Electronic device and method of manufacturing the same

ABSTRACT

An electronic device includes a display member including a plurality of display elements and a sensing member including a first sensing pattern disposed on the display member and a second sensing pattern disposed on the display member and capacitively coupled to the first sensing pattern. Each of the first and second sensing patterns includes a plurality of mesh lines to define a plurality of openings. Each of the first and second sensing patterns includes a unit mesh pattern including a central opening and a plurality of peripheral openings surrounding the central opening. A plurality of cutting lines, each of which opens at least two adjacent openings of the plurality of peripheral openings to each other, are defined in the unit mesh pattern. The cutting lines are arranged in a direction surrounding the central opening.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a divisional application of U.S. patent applicationSer. No. 15/985,379 filed May 21, 2018, which claims priority to and thebenefits of Korean Patent Application No. 10-2017-0065587, filed on May26, 2017 under 35 U.S.C. § 119, the disclosures of which are hereinincorporated by reference in their entirety.

BACKGROUND 1. Field

Embodiments of the present disclosure relate to an electronic deviceand, more particularly, to an electronic device with improved visibilityand a method of manufacturing the same.

2. Description of the Related Art

An electronic device is activated by an electrical signal appliedthereto. An electronic device may include a display device that isconfigured to display an image or a touch screen that is configured tosense a touch provided from the outside.

An electronic device may include various electrode patterns to beactivated by an electrical signal. An area in which electrode patternsare activated may display information or may respond by a touch providedfrom the outside.

SUMMARY

Embodiments of the present disclosure may provide an electronic devicecapable of preventing touch sensors from being viewed by reflection ofexternal light.

Embodiments of the present disclosure may also provide a method ofmanufacturing an electronic device that is capable of forming a touchsensor with improved visibility.

In an aspect, an electronic device includes a display member including aplurality of display elements and divided into light emitting areas, inwhich the display elements are respectively disposed, and a peripheralarea adjacent to the light emitting areas when viewed from a plan view,and a sensing member including a first sensing pattern disposed on thedisplay member and a second sensing pattern disposed on the displaymember and capacitively coupled to the first sensing pattern. Each ofthe first and second sensing patterns includes a plurality of mesh linesdisposed in the peripheral area to define a plurality of openingsoverlapping with the light emitting areas, respectively. Each of thefirst and second sensing patterns includes a unit mesh pattern includinga central opening and a plurality of peripheral openings surrounding thecentral opening. The central opening and the peripheral openings areincluded in the plurality of openings. A plurality of cutting lines,each of which opens at least two adjacent openings of the plurality ofperipheral openings to each other, are defined in the unit mesh pattern.The cutting lines are arranged in a direction surrounding the centralopening.

Each of the cutting lines may be defined to connect centers of some ofthe peripheral openings, and portions of the mesh lines that overlapwith the cutting lines may be cut to open the peripheral openings.

The peripheral openings may be arranged to surround the central openingin the unit mesh pattern, and the unit mesh pattern may have a shapecorresponding to a shape of the opening.

The unit mesh pattern may include a central mesh pattern in which thecentral opening is defined, the central mesh pattern having aquadrilateral shape, and a sub-mesh pattern in which the peripheralopenings are defined, the sub-mesh pattern having a frame shapesurrounding the central mesh pattern. The cutting lines may be spacedapart from each other in the sub-mesh pattern and may be arranged in aclockwise direction or counterclockwise direction around the centralmesh pattern.

The sub-mesh pattern may include first sub-mesh patterns that arerespectively adjacent to four sides of the central mesh pattern, whereinfirst cutting lines are defined in the first sub-mesh patterns, andsecond sub-mesh patterns that are respectively adjacent to four vertexesof the central mesh pattern, wherein second cutting lines are defined inthe second-sub-mesh patterns. In such an embodiment, i peripheralopenings may be defined in each of the first sub-mesh patterns where ‘i’is a natural number, and i×i peripheral openings may be defined in eachof the second sub-mesh patterns.

Each of the first cutting lines may have a line shape that extends in adirection intersecting adjacent one of the four sides of the centralmesh pattern.

Each of the second cutting lines may have a closed-loop shape.

Each of the second cutting lines may have an X-shape.

The sub-mesh pattern may include a first sub-mesh pattern that has aquadrilateral frame shape surrounding an edge of the central meshpattern, wherein first cutting lines are defined in the first sub-meshpattern, and a second sub-mesh pattern that has a quadrilateral frameshape surrounding the first sub-mesh pattern, wherein second cuttinglines are defined in the second sub-mesh pattern. Each of the firstcutting lines may have a straight line shape, and each of the firstcutting lines may extend in parallel to adjacent one of four sides ofthe central mesh pattern.

The second cutting lines may have the same shapes as the first cuttinglines, and each of the second cutting lines may extend in parallel toadjacent one of four sides of the first sub-mesh pattern.

Each of the second cutting lines may have a bent line shape, and thesecond cutting lines may be respectively adjacent to four vertexes ofthe first sub-mesh pattern and are arranged to surround the fourvertexes.

A plurality of unit mesh patterns may be arranged, and outermost meshlines of adjacent unit mesh patterns overlap with each other.

A plurality of unit mesh patterns may be arranged, and at least one ofthe cutting lines of one unit mesh pattern is connected to acorresponding one of the cutting lines of another unit mesh pattern thatis adjacent to the one unit mesh pattern.

In another aspect, a method of manufacturing an electronic deviceincludes providing an initial mesh substrate including first mesh linesextending in parallel to each other in a first direction and second meshlines extending in parallel to each other in a second direction thatintersects the first direction, the initial mesh substrate including aplurality of unit mesh patterns in which cutting lines that cut portionsof the first and second mesh lines are defined, cutting the first andsecond mesh lines along a boundary line connecting at least some of thecutting lines to form a plurality of sensing patterns, and forming aninsulating layer on the plurality of sensing patterns. The cutting linesinclude a line that extends in the first direction or the seconddirection and links centers of two openings adjacent to each other.

The unit mesh pattern may include a central mesh pattern in which acentral opening is defined, and a sub-mesh pattern in which peripheralopenings that surround the central opening are defined. The cuttinglines may be defined in the sub-mesh pattern to open at least two of theperipheral openings to each other.

The cutting lines may be spaced apart from each other and may bearranged in a clockwise direction or counterclockwise direction aroundthe central mesh pattern.

At least one of the cutting lines may have a cross shape that includes afirst pattern extending in the first direction and a second patternextending in the second direction and crossing over the first pattern. Acrossing point of the first and second patterns may be a center of oneof the peripheral openings.

At least one of the cutting lines may have a closed-loop shape.

The cutting of the first and second mesh lines along the boundary linemay include cutting the mesh lines disposed between the at least some ofthe cutting lines, and each of the at least some of the cutting linesmay entirely overlap with the boundary line.

The method may further include forming a bridge pattern connecting someof the plurality of sensing patterns on the insulating layer. Theforming of the insulating layer may include forming an insulating layercovering the plurality of sensing patterns, and forming a contact holein the insulating layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the present disclosure willbecome more apparent by describing in further detail exemplaryembodiments thereof with reference to the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating an electronic device accordingto an embodiment of the present disclosure.

FIG. 2 is a plan view of the electronic device illustrated in FIG. 1.

FIG. 3A is an enlarged plan view illustrating an area ‘XX’ of FIG. 2.

FIG. 3B is a cross-sectional view taken along a line I-I′ of FIG. 3A.

FIG. 4A is an enlarged plan view illustrating some elements of FIG. 3A.

FIGS. 4B and 4C are plan views illustrating some elements of FIG. 4A.

FIG. 4D is a plan view illustrating another example of some elements ofFIG. 4A.

FIG. 5A is a plan view illustrating a unit mesh pattern according to anembodiment of the present disclosure.

FIGS. 5B and 5C are plan views illustrating some elements of the unitmesh pattern of FIG. 5A.

FIG. 6A is a plan view illustrating a unit mesh pattern according to anembodiment of the present disclosure.

FIG. 6B is a plan view illustrating some elements of the unit meshpattern of FIG. 6A.

FIGS. 7A to 7F are plan views related to a unit mesh pattern accordingto an embodiment of the present disclosure.

FIGS. 8A to 8C are plan views illustrating a method of manufacturing anelectronic device, according to an embodiment of the present disclosure.

FIGS. 9A to 9C are plan views illustrating a method of manufacturing anelectronic device, according to an embodiment of the present disclosure.

FIGS. 10A to 10C are plan views illustrating a method of manufacturingan electronic device, according to an embodiment of the presentdisclosure.

FIGS. 11A to 11C are plan views illustrating a method of manufacturingan electronic device, according to an embodiment of the presentdisclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating an electronic device accordingto an embodiment of the present disclosure. An electronic device EA isactivated by an electrical signal applied thereto. The electronic deviceEA may have an active area AA and a peripheral area NAA on a plane thatis defined by a first direction D1 and a second direction D2.

The active area AA may be electrically activated when an electricalsignal is supplied thereto. The active area AA may be used to activatevarious function on the basis of a use of the electronic device EA.

For example, the active area AA may correspond to a sensing area thatsenses an input provided from the outside. As illustrated in FIG. 1, theelectronic device EA may sense an external input TC applied to theactive area AA. In this regard, the electronic device EA may function asan input device.

The external input TC corresponds to a finger of a user in FIG. 1.However, embodiments of the present disclosure are not limited thereto.The external input TC may be provided in various forms. For example, theexternal input TC may be, but not limited to, a contact or a touch of aportion of a human body (e.g., a finger of a user), a force, a pressure,and/or light.

The active area AA may correspond to, for example, a display area thatdisplays predetermined information. The electronic device EA may displayan image on the active area AA, and a user may obtain informationthrough the image. In this regard, the electronic device EA may functionas an output device.

The peripheral area NAA is disposed to be adjacent to the active areaAA. Even though an electrical signal is applied, the peripheral area NAAmay neither display an image nor sense an external input.

Signal lines and/or driving elements may be disposed in the peripheralarea NAA. The signal lines may be provided for applying signals from theoutside to the active area AA, and the driving elements may be providedfor driving the active area AA. The peripheral area NAA may be disposedto be adjacent to a side of the active area AA.

In the present embodiment, the peripheral area NAA has a frame shapethat surrounds the active area AA. However, embodiments of the presentdisclosure are not limited thereto. In one embodiment, the peripheralarea NAA may be omitted in the electronic device EA. In someembodiments, the shape of the peripheral area NAA may be variouslydefined and may not be limited to a specific shape.

FIG. 1 illustrates a touch screen device as an example of the electronicdevice EA. However, embodiments of the present disclosure are notlimited thereto. In a certain embodiment, a display function may beomitted in the electronic device EA.

FIG. 2 is a plan view of the electronic device illustrated in FIG. 1.FIG. 3A is an enlarged plan view illustrating an area ‘XX’ of FIG. 2,and FIG. 3B is a cross-sectional view taken along a line I-I′ of FIG.3A. For the purpose of ease and convenience in description andillumination, some elements are omitted in FIGS. 2, 3A, and 3B.Hereinafter, an electronic device EA according to an embodiment of thepresent disclosure will be described in detail with reference to FIGS.2, 3A, and 3B.

As illustrated in FIG. 3B, the electronic device EA includes a displaymember DM and a sensing member SM. In the present embodiment, thesensing member SM is disposed on the display member DM. In the presentembodiment, the sensing member SM is illustrated as a single-layeredsensing member. However, embodiments of the present disclosure are notlimited thereto.

The sensing member SM includes first touch electrodes TE1-1, TE1-2,TE1-3, and TE1-4, second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4,and TE2-5, first touch signal lines SL1-1, SL1-2, SL1-3, and SL1-4 thatare respectively connected to the first touch electrodes TE1-1, TE1-2,TE1-3, and TE1-4, second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4,and SL2-5 that are respectively connected to the second touch electrodesTE2-1, TE2-2, TE2-3, TE2-4, and TE2-5, touch pads PADa, and a coverlayer CVL.

The first touch electrodes TE1-1, TE1-2, TE1-3, and TE1-4 and the secondtouch electrodes TE2-1, TE2-2, TE2-3, TE2-4, and TE2-5 may be disposedin the active area AA. The first touch signal lines SL1-1, SL1-2, SL1-3,and SL1-4, the second touch signal lines SL2-1, SL2-2, SL2-3, SL2-4, andSL2-5, and the touch pads PADa may be disposed in the peripheral areaNAA.

The first touch electrodes TE1-1, TE1-2, TE1-3, and TE1-4 extend in thesecond direction D2 and are arranged in the first direction D1. Each ofthe first touch electrodes TE1-1, TE1-2, TE1-3, and TE1-4 may include aplurality of first sensing patterns SP1. The first sensing patterns SP1are arranged in the second direction D2 and are connected to each otherthrough first connection portions CP1.

The second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, and TE2-5 extendin the first direction D1 and are arranged in the second direction D2.Each of the second touch electrodes TE2-1, TE2-2, TE2-3, TE2-4, andTE2-5 may include a plurality of second sensing patterns SP2. The secondsensing patterns SP2 are insulated from and intersect the first sensingpatterns SP1. The second sensing patterns SP2 are arranged in the firstdirection D1 and are connected to each other through second connectionportions CP2.

The touch pads PADa are connected to the first touch signal lines SL1-1,SL1-2, SL1-3, and SL1-4 and the second touch signal lines SL2-1, SL2-2,SL2-3, SL2-4, and SL2-5. The sensing member SM transmits/receiveselectrical signals through the first touch signal lines SL1-1, SL1-2,SL1-3, and SL1-4 and the second touch signal lines SL2-1, SL2-2, SL2-3,SL2-4, and SL2-5 to activate the first sensing patterns SP1 and thesecond sensing patterns SP2.

In one embodiment, the first sensing patterns SP1 and the second sensingpatterns SP2 are capacitively coupled to each other. The sensing memberSM may sense information of the external input TC (see FIG. 1) bymeasuring variations in capacitance between the first sensing patternsSP1 and the second sensing patterns SP2 caused by the external input TC.

Referring to FIG. 3A, each of the first sensing patterns SP1 and thesecond sensing patterns SP2 may have a mesh shape. In more detail, eachof the first and second sensing patterns SP1 and SP2 includes aplurality of mesh lines defining a plurality of touch openings TS-OP.

FIG. 3A illustrates planar arrangement relation between the displaymember DM and the sensing member SM. For the purpose of ease andconvenience in description and illumination, planar shapes of lightemitting areas PXA are illustrated together with the first sensingpatterns SP1 and the second sensing patterns SP2 in FIG. 3A.

Each of the light emitting areas PXA may display a red color, a greencolor, or a blue color. However, embodiments of the present disclosureare not limited thereto. In certain embodiments, the light emittingareas PXA may further include light emitting areas, each of whichdisplays a magenta color, a cyan color, or a white color. Sizes (orareas) of the light emitting areas PXA may be different from each otheron the basis of the colors displayed by the light emitting areas PXA.

In the present embodiment, the light emitting areas PXA may be arrangedin a fourth direction D4 and a fifth direction D5. The fourth directionD4 intersects the first and second directions D1 and D2, and the fifthdirection intersects the fourth direction D4. In the present embodiment,each of the light emitting areas PXA may have a diamond shape havingsides that are defined by the fourth and fifth directions D4 and D5.

In FIG. 3A, the first and second sensing patterns SP1 and SP2 are shadedfor the purpose of easy identification. The first and second sensingpatterns SP1 and SP2 are disposed to overlap with a non-light emittingarea NPXA.

As described above, each of the first and second sensing patterns SP1and SP2 includes the plurality of mesh lines. The mesh lines aredisposed in the non-light emitting area NPXA.

In more detail, each of the first sensing patterns SP1 includes aplurality of first mesh lines MSL1-A extending in the fourth directionD4 and spaced apart from each other in the fifth direction D5, and aplurality of second mesh lines MSL2-A extending in the fifth directionD5 and spaced apart from each other in the fourth direction D4. Thesecond mesh lines MSL2-A are cross-linked to the first mesh linesMSL1-A. Each of the second sensing patterns SP2 includes a plurality offirst mesh lines MSL1-B and a plurality of second mesh lines MSL2-B thatare cross-linked to the first mesh lines MSL1-B.

The first mesh lines MSL1-A and the second mesh lines MSL2-A define thetouch openings TS-OP. Likewise, the first mesh lines MSL1-B and thesecond mesh lines MSL2-B also define the touch openings TS-OP.

The touch openings TS-OP may have diamond shapes corresponding to theshapes of the light emitting areas PXA and may be defined in areasrespectively corresponding to the light emitting areas PXA. Areas of thetouch openings TS-OP may be equal to or greater than areas of the lightemitting areas PXA when viewed in a plan view. Each of the touchopenings TS-OP may entirely overlap with a corresponding one of thelight emitting areas PXA.

Referring to FIG. 3B, the display member DM may include a base layerBSL, a pixel defining layer PDL, display elements DEM, and a sealinglayer EC. FIG. 3B illustrates a first light emitting area PXA1 and asecond light emitting area PXA2 of the light emitting areas PXA.

Even though not shown in the drawings, the base layer BSL may include aplurality of insulating layers and a plurality of conductive layers.Thin film transistors and capacitors that are connected to the displayelements DEM may be formed in the plurality of conductive layers and theplurality of insulating layers.

Each of the display elements DEM is disposed on the base layer BSL. Thedisplay element DEM may emit light in response to an electrical signaltransmitted through the connected thin film transistor and capacitor,thereby displaying an image.

Various display elements may be used as the display element DEM. Forexample, the display element DEM may be an electrophoretic element, aliquid crystal capacitor, an electro-wetting element, or an organiclight emitting element. In the present embodiment, the organic lightemitting element is described as an example of the display element DEM.

The pixel defining layer PDL is disposed on the base layer BSL. OpeningsOP are defined in the pixel defining layer PDL. Each of the openings OPmay define an area in which one display element DEM is formed.

The display element DEM includes a first electrode EL1, a light emittinglayer EML, and a second electrode EL2. The display element DEM mayactivate the light emitting layer EML by a potential difference betweenthe first and second electrodes EL1 and EL2, thereby emitting light.Thus, the light emitting areas PXA may correspond to areas in which thelight emitting layers EML are disposed.

On the other hand, a size (or an area) of the first light emitting areaPXA1 may be different from that of the second light emitting area PXA2.In the present embodiment, the size (or the area) of the second lightemitting area PXA2 is greater than that of the first light emitting areaPXA1. This is because a color of light emitted from the first lightemitting area PXA1 is different from a color of light emitted from thesecond light emitting area PXA2 as described above. Thus, it is possibleto improve light efficiencies of the light emitting areas that emitlights of different colors.

The sealing layer EC covers the display elements DEM and the pixeldefining layer PDL. The sealing layer EC may include a plurality oforganic and/or inorganic layers. The sealing layer EC prevents moisturefrom permeating into the display element DEM and protects the displayelement DEM. In addition, the sealing layer EC electrically isolates thedisplay member DM from the sensing member.

The sensing member SM is disposed on the sealing layer EC of the displaymember DM. However, embodiments of the present disclosure are notlimited thereto. In certain embodiments, the sensing member SM may bedisposed under the sealing layer EC, or a member (not shown) such as acolor filter may be disposed between the sensing member SM and thesealing layer EC.

The sensing member SM may include the cover layer CVL, as describedabove. The cover layer CVL is disposed on the sensing patterns SP1 andSP2 to protect the sensing patterns SP1 and SP2. The cover layer CVLincludes an insulating material.

As illustrated in FIG. 3B, the first mesh line MSL1-B and the secondmesh line MSL2-B are disposed to overlap with the pixel defining layerPDL when viewed in a plan view. The first mesh line MSL1-B and thesecond mesh line MSL2-B do not overlap with the light emitting areasPXA1 and PXA2.

Thus, the influence of the sensing patterns SP1 and SP2 on displayingcharacteristics of the electronic device EA may be reduced, and the meshlines MSL1-B and MSL2-B can be formed of an opaque material to increaseor improve the degree of freedom for selecting a material of the sensingpatterns SP1 and SP2.

Meanwhile, in the present embodiment, each of the mesh lines may have ashape that is partially cut. In more detail, as illustrated in FIG. 3A,each of the first mesh lines MSL1-A and MSL1-B includes first cuttingportions TS-CP1 that are partially cut. Each of the second mesh linesMSL2-A and MSL2-B includes second cutting portions TS-CP2 that arepartially cut. Thus, a cut space CC may be formed as illustrated in FIG.3B. The cut space CC may correspond to a region that is defined by thecutting portion formed by removing a portion of the mesh line.

The sensing patterns SP1 and SP2 according to an embodiment of thepresent disclosure include the cut spaces CC including the first cuttingportions TS-CP1 and the second cutting portions TS-CP2, thereby reducingdifferences in reflectivity between the insides of the sensing patternsSP1 and SP2 and boundaries of the sensing patterns SP1 and SP2. As aresult, a problem that sensing patterns SP1 and SP2 are viewed byreflection of external light may be prevented to realize the electronicdevice EA with improved visibility.

Referring again to FIG. 2, even though not shown in detail in thedrawings, the first touch signal lines SL1-1 to SL1-4 and the secondtouch signal lines SL2-1 to SL2-5 may also include mesh lines. However,embodiments of the present disclosure are not limited thereto. Incertain embodiments, the first touch signal lines SL1-1 to SL1-4 and thesecond touch signal lines SL2-1 to SL2-5 may be, but not limited to,linear conductive patterns.

FIG. 4A is an enlarged plan view illustrating some elements of FIG. 3A.FIGS. 4B and 4C are plan views illustrating some elements of FIG. 4A.For the purpose of ease and convenience in description and illumination,FIGS. 4B and 4C illustrate elements included in layers different fromeach other.

In more detail, FIG. 4B illustrates elements, included in a first layerA1, among elements illustrated in FIG. 4A, and FIG. 4C illustrateselements, included in a second layer A2, among the elements illustratedin FIG. 4A. The second layer A2 is disposed on the first layer A1.Hereinafter, an embodiment of the present disclosure will be describedwith reference to FIGS. 4A to 4C. Meanwhile, the same elements asdescribed with reference to FIGS. 1, 2, 3A, and 3B are indicated by thesame reference designators, and the descriptions thereof are omitted forthe purpose of ease and convenience in description and illumination.

FIG. 4A is an enlarged view that illustrates the connection portionconnecting the first sensing patterns SP1 and the connection portionconnecting the second sensing patterns SP2. A first bottom-side sensingpattern SSP1_1 and a first top-side sensing pattern SSP1_2 areillustrated as some of the first sensing patterns SP1 in FIG. 4A, and asecond right-side sensing pattern SSP2_1 and a second left-side sensingpattern SSP2_2 are illustrated as some of the sensing patterns SP2 inFIG. 4A.

Each of the first sensing patterns SP1 and the second sensing patternsSP2 includes first mesh lines MSL1 extending in the fourth direction D4and second mesh lines MSL2 extending in the fifth direction D5.Meanwhile, sizes (or areas) of the touch openings TS-OP defined by thefirst mesh lines MSL1 and the second mesh lines MSL2 are shown to beequal to each other in FIGS. 4A and 4B for the purpose of ease andconvenience in description and illumination.

In the present embodiment, the first connection portion CP1 is disposedin a layer different from a layer in which the first sensing patternsSP1, the second sensing patterns SP2, and the second connection portionCP2 are disposed. Referring to FIGS. 4A and 4B, the first sensingpatterns SP1, the second sensing patterns SP2, and the second connectionportion CP2 have mesh shapes and are included in the first layer A1.

Some of the mesh lines MSL1 and MSL2 of the second right-side sensingpattern SSP2_1 and the second left-side sensing pattern SSP2_2 extend todefine the second connection portion CP2. In the present embodiment, thesecond connection portion CP2 may have a mesh shape having two touchopenings TS-OP and may extend in the first direction D1. The firstbottom-side sensing pattern SSP1_1 and the first top-side sensingpattern SSP1_2 are spaced apart from each other with the secondconnection portion CP2 interposed therebetween.

The first sensing patterns SP1 and the second sensing patterns SP2include the cutting portions TS-CP, as described above. Each of thefirst bottom-side sensing pattern SSP1_1 and the first top-side sensingpattern SSP1_2 includes the cutting portions TS-CP that are spaced apartfrom each other and are formed in the first mesh lines MSL1 and/or thesecond mesh lines MSL2. Likewise, the cutting portions TS-CP are formedin the second right-side sensing pattern SSP2_1 and the left-sidesensing pattern SSP2_2.

Meanwhile, areas from which the touch openings TS-OP are removed existin the second right-side sensing pattern SSP2_1 and the second left-sidesensing pattern SSP2_2. In other words, each of the second right-sidesensing pattern SSP2_1 and the second left-side sensing pattern SSP2_2has portions in which the first mesh lines MSL1 and the second meshlines MSL2 are removed.

These removed portions of the mesh lines may be provided in areas wherethe first connection portion CP1 is placed preventing overlappingbetween the first connection portion CP1 and the second sensing patternsSP2. Since the portions of the mesh lines of the second right-side andleft-side sensing patterns SSP2_1 and SSP2_2 are removed in areas thatoverlap with the first connection portion CP1, the first connectionportion CP1 may not overlap with the second sensing patterns SP2,thereby preventing occurrence of a parasitic capacitor or a shortbetween the first connection portion CP1 and the second sensing patternsSP2, and improving reliability of the electronic device.

Referring to FIGS. 4A and 4C, the first connection portion CP1 isdisposed in the layer different from the layer in which the firstsensing patterns SP1 are disposed. In the present embodiment, the firstconnection portion CP1 is disposed in the second layer A2.

Thus, the first connection portion CP1 is connected to the first sensingpatterns SP1 through contact holes CH. The first bottom-side sensingpattern SSP1_1 and the first top-side sensing pattern SSP1_2 that arespaced apart from each other are electrically connected to each otherthrough the first connection portion CP1.

The first connection portion CP1 includes a first extension EX1 and asecond extension EX2 that are spaced apart from each other in the firstdirection D1 with the second connection portion CP2 interposedtherebetween when viewed in a plan view. The first extension EX1 and thesecond extension EX2 may be symmetrical with respect to the secondconnection portion CP2.

Each of the first extension EX1 and the second extension EX2 may beprovided in plurality. In more detail, there are two first extensionsEX1 including first, second, third, and fourth sub-extensions EX1_1,EX1_2, EX1_3, and EX1_4. The first sub-extension EX1_1 and the thirdsub-extension EX1_3 are connected to each other to constitute one of thefirst extensions EX1, and the second sub-extension EX1_2 and the fourthsub-extension EX1_4 are connected to each other to constitute the otherof the first extensions EX1.

Similarly, there are two second extensions EX2 including fifth, sixth,seventh, and eighth sub-extensions EX2_1, EX2_2, EX2_3, and EX2_4. Thefifth sub-extension EX2_1 and the seventh sub-extension EX2_3 areconnected to each other to constitute one of the second extensions EX2,and the sixth sub-extension EX2_2 and the eighth sub-extension EX2_4 areconnected to each other to constitute the other of the second extensionsEX2.

Each of the first and second extensions EX1 and EX2 is connected to thefirst sensing patterns SP1 through a respective contact hole CH. Sincethe first sensing patterns SP1 are electrically connected to each otherthrough the plurality of extensions EX1 and EX2, an electrical signalcan be transmitted between the first sensing patterns SP1 while reducingelectrical noise and improving touch sensitivity.

On the other hand, as illustrated in FIG. 4D, a first connection portionCP1-1 according to another embodiment may include first extensions EX1-1that are connected to each other, and second extensions EX2-1 that areconnected to each other.

The first extensions EX1-1 may include first, second, third, and fourthsub-extensions EX1-1_1, EX1-1_2, EX1-1_3, and EX1-1_4 respectivelycorresponding to the first, second, third, and fourth sub-extensionsEX1_1, EX1_2, EX1_3, and EX1_4 illustrated in FIG. 4C and may furtherinclude first and second connection extensions EX1-1_5 and EX1-1_6. Thefirst connection extension EX1-1_5 extends in the fourth direction D4 toconnect the third and fourth sub-extensions EX1-1_3 and EX1-1_4 to eachother, and the second connection extension EX1-1_6 extends in the fifthdirection D5 to connect the first and second sub-extensions EX1-1_1 andEX1-1_2. Thus, the first extensions EX1-1 may be connected to each otherto constitute a single electrode pattern.

The second extensions EX2-1 and the first extensions EX1-1 aresymmetrical with respect to an imaginary line extending in the seconddirection D2 therebetween. Thus, the second extensions EX2-1 may includefifth, sixth, seventh, and eighth sub-extensions EX2-1_1, EX2-1_2,EX2-1_3, and EX2-1_4 respectively corresponding to the fifth, sixth,seventh, and eighth sub-extensions EX2_1, EX2_2, EX2_3, and EX2_4illustrated in FIG. 4C and may further include third and fourthconnection extensions EX2-1_5 and EX2-1_6. Thus, the second extensionsEX2-1 may be connected to each other to constitute a single electrodepattern.

An electronic device according to an embodiment of the presentdisclosure may include at least one of electrode patterns having variousshapes and may not be limited to a specific embodiment.

FIG. 5A is a plan view illustrating a unit mesh pattern according to anembodiment of the present disclosure. FIGS. 5B and 5C are plan viewsillustrating some elements of the unit mesh pattern of FIG. 5A.

FIG. 5A illustrates a partial area, corresponding to a unit mesh patternUN, among the first sensing patterns SP1 and the second sensing patternsSP2 illustrated in FIG. 2A. Each of the first and second sensingpatterns SP1 and SP2 may have a shape in which the unit mesh patterns UNare repeatedly and continuously arranged.

Referring to FIG. 5A, the unit mesh pattern UN may be defined by eightmesh lines intersecting each other. In more detail, the unit meshpattern UN may be defined by first to fourth mesh lines MSL11, MSL12,MSL13, and MSL14 extending in parallel to each other in the fourthdirection D4 and fifth to eighth mesh lines MSL21, MSL22, MSL23, andMSL24 extending in parallel to each other in the fifth direction D5.

The first to fourth mesh lines MSL11, MSL12, MSL13, and MSL14 maysubstantially correspond to some of the first mesh lines MSL1illustrated in FIG. 4A, and the fifth to eighth mesh lines MSL21, MSL22,MSL23, and MSL24 may substantially correspond to some of the second meshlines MSL2 illustrated in FIG. 4A.

The unit mesh pattern UN according to an embodiment of the presentdisclosure may include a plurality of openings. The number of theplurality of openings may be (2N+1)×(2N+1) where ‘N’ is a naturalnumber, and the plurality of openings may be arranged in a matrix formdefined by the fourth and fifth directions D4 and D5.

For example, as illustrated in FIG. 5A, the unit mesh pattern UN mayinclude nine openings that are arranged in a 3×3 matrix form. Theopenings may include a central opening OP10 and peripheral openingsOP20_a, OP20_b, and OP20_c.

The central opening OP10 may be disposed at a center of the unit meshpattern UN. The second and third mesh lines MSL12 and MSL13 among thefirst to fourth mesh lines MSL11 to MSL14 may be relatively close to thecenter of the unit mesh pattern UN, and the sixth and seventh mesh linesMSL22 and MSL23 among the fifth to eighth mesh lines MSL21 to MSL24 maybe relatively close to the center of the unit mesh pattern UN. Thecentral opening OP10 may be defined by the second and third mesh linesMSL12 and MSL13 and the sixth and seventh mesh lines MSL22 and MSL23that intersect the second and third mesh lines MSL12 and MSL13.

The second, third, sixth, and seventh mesh lines MSL12, MSL13, MSL22,and MSL23 defining the central opening OP10 may define a first sub-meshpattern 10. FIG. 5B illustrates the first sub-mesh pattern 10.

As illustrated in FIGS. 5A and 5B, the first sub-mesh pattern 10 may bea pattern that defines the central opening OP10. The first sub-meshpattern 10 has a diamond shape when viewed in a plan view. Portions ofthe second, third, sixth, and seventh mesh lines MSL12, MSL13, MSL22,and MSL23 may correspond to four sides of the first sub-mesh pattern 10,respectively.

Here, the portions of the second, third, sixth, and seventh mesh linesMSL12, MSL13, MSL22, and MSL23 defining the first sub-mesh pattern 10 donot include a cut portion. Thus, the central opening OP10 may not beconnected to neighboring openings but may be defined as a closed areathat is surrounded by the second, third, sixth, and seventh mesh linesMSL12, MSL13, MSL22, and MSL23.

Referring again to FIG. 5A, the peripheral openings OP20_a, OP20_b, andOP20_c may be arranged along an edge of the central opening OP10. Theperipheral openings OP20_a, OP20_b, and OP20_c may be defined by theintersection of the first to fourth mesh lines MSL11 to MSL14 and thefifth to eighth mesh lines MSL21 to MSL24.

The first to fourth mesh lines MSL11 to MSL14 and the fifth to eighthmesh lines MSL21 to MSL24 defining the peripheral openings OP20_a,OP20_b, and OP20_c may define a second sub-mesh pattern 20. FIG. 5Cillustrates the second sub-mesh pattern 20 for the purpose of ease andconvenience in description.

As illustrated in FIGS. 5A and 5C, the second sub-mesh pattern 20 hasthe peripheral openings OP20_a, OP20_b, and OP20_c. The second sub-meshpattern 20 has a quadrilateral frame shape that surrounds the firstsub-mesh pattern 10. The first to fourth mesh lines MSL11 to MSL14 andthe fifth to eighth mesh lines MSL21 to MSL24 may correspond to sideswhich define the frame shape of the second sub-mesh pattern 20.

In more detail, outer sides of the frame shape may correspond toportions of the first and fourth mesh lines MSL11 and MSL14, disposedrelatively outside, among the first to fourth mesh lines MSL11, MSL12,MSL13, and MSL14 and portions of the fifth and eighth mesh lines MSL21and MSL24, disposed relatively outside, among the fifth to eighth meshlines MSL21, MSL22, MSL23, and MSL24. Inner sides of the frame shape maycorrespond to portions of the second and third mesh lines MSL12 andMSL13, disposed relatively inside, among the first to fourth mesh linesMSL12, MSL12, MSL13, and MSL13 and portions of the sixth and seventhmesh lines MSL22 and MSL23, disposed relatively inside, among the fifthto eighth mesh lines MSL22, MSL22, MSL23, and MSL23.

The four mesh lines MSL12, MSL13, MSL22, and MSL23 defining the innersides may additionally divide the quadrilateral frame shape of thesecond sub-mesh pattern 20 into a plurality of areas. Thus, the first tofourth mesh lines MSL11 to MSL14 and the fifth to eighth mesh linesMSL21 to MSL24 may define eight peripheral openings OP20_a, OP20_b, andOP20_c, arranged to surround the central opening OP10, in the secondsub-mesh pattern 20.

Meanwhile, the four mesh lines MSL12, MSL13, MSL22, and MSL23 definingthe inner sides of the second sub-mesh pattern 20 may be the four meshlines MSL12, MSL13, MSL22, and MSL23 defining the four sides of thefirst sub-mesh pattern 10. In other words, the four mesh lines MSL12,MSL13, MSL22, and MSL23 defining the inner sides may be included in orshared by both the first sub-mesh pattern 10 and the second sub-meshpattern 20. Thus, the shape of the second sub-mesh pattern 20 issubstantially the same as the shape of the unit mesh pattern UN.

The second sub-mesh pattern 20 may include a plurality of cutting linesCT1_a, CT1_b, CT1_c, and CT1_d. The cutting lines CT1_a, CT1_b, CT1_c,and CT1_d may be imaginary lines that cut portions of the mesh lines,respectively.

Each of the cutting lines CT1_a, CT1_b, CT1_c, and CT1_d may have a lineshape that links two centers of two openings adjacent to each other witha predetermined mesh line interposed therebetween. The cutting portionTS-CP is defined in a portion of the mesh line that overlaps with eachof the cutting lines CT1_a, CT1_b, CT1_c, and CT1_d. In FIG. 5C, thecutting lines CT1_a, CT1_b, CT1_c, and CT1_d are shown as dark lines forthe purpose of ease and convenience in description and illumination.

In the present embodiment, the cutting lines CT1_a, CT1_b, CT1_c, andCT1_d are spaced apart from each other. The cutting lines CT1_a, CT1_b,CT1_c, and CT1_d are arranged to surround the central opening OP10 inthe second sub-mesh pattern 20.

A longitudinal direction of the cutting lines CT1_a, CT1_b, CT1_c, andCT1_d may be different from that of others cutting lines CT1_a, CT1_b,CT1_c, and CT1_d. For example, the cutting lines CT1_a, CT1_b, CT1_c,and CT1_d may include first and third cutting lines CT1_a and CT1_c thatextend in the fifth direction D5, and second and fourth cutting linesCT1_b and CT1_d that extend in the fourth direction D4.

The cutting lines CT1_a, CT1_b, CT1_c, and CT1_d may be arranged alongthe quadrilateral frame shape of the second sub-mesh pattern 20. Inaddition, the cutting lines CT1_a, CT1_b, CT1_c, and CT1_d may bearranged in such a way that each of the cutting lines CT1_a, CT1_b,CT1_c, and CT1_d extends in a direction parallel to an outer sideadjacent thereto.

Thus, the fourth and second cutting lines CT1_d and CT1_b adjacent tothe outer sides defined by the first and fourth mesh lines MSL11 andMSL14 may extend in the fourth direction D4. The first and third cuttinglines CT1_a and CT1_c adjacent to the outer sides defined by the fifthand eighth mesh lines MSL21 and MSL24 may extend in the fifth directionD5.

The first to fourth cutting lines CT1_a, CT1_b, CT1_c, and CT1_d aredisposed along a clockwise direction in the second sub-mesh pattern 20to cut four mesh lines MSL12, MSL22, MSL13, and MSL23 among the meshlines defining a plurality of the openings.

In more detail, as illustrated in FIG. 5C, the first cutting line CT1_acuts the second mesh line MSL12. The second cutting line CT1_b is spacedapart from the first cutting line CT1_a with the third mesh line MSL13interposed therebetween and cuts the sixth mesh line MSL22. The thirdcutting line CT1_c is spaced apart from the second cutting line CT1_bwith the seventh mesh line MSL23 interposed therebetween and cuts thethird mesh line MSL13. The fourth cutting line CT1_d is spaced apartfrom the third cutting line CT1_c with the second mesh line MSL12interposed therebetween and cuts the seventh mesh line MSL23.

Referring again to FIG. 5A, as a result, the unit mesh pattern UN mayinclude the plurality of peripheral openings surrounding the centralopening OP10, and two adjacent peripheral openings among the peripheralopenings may be connected or opened to each other through the cuttingportion TS-CP. The peripheral openings may include first to thirdopenings OP20_a, OP20_b, and OP20_c adjacent to each other. The secondand third openings OP20_b and OP20_c among the first to third openingsOP20_a, OP20_b, and OP20_c may be connected or opened to each otherthrough the cutting portion TS-CP. The cutting portion TS-CP connectingthe second and third openings OP20_b and OP20_c may be a cutting portionformed by the third cutting line CT1_c illustrated in FIG. 5C.

The first and second openings OP20_a and OP20_b among the first to thirdopenings OP20_a, OP20_b, and OP20_c are not connected or opened to eachother. A portion of the second mesh line MSL12 that is disposed betweenthe first and second openings OP20_a and OP20_b does not overlap withthe cutting line. However, the first opening OP20_a may be connected oropened to another peripheral opening that is adjacent thereto with theseventh mesh line MSL23 interposed therebetween, through a cuttingportion formed by the first cutting line CT1_d.

The unit mesh pattern UN according to an embodiment of the presentdisclosure may be provided in plurality, and the plurality of unit meshpatterns UN may constitute each of the first and second sensing patternsSP1 and SP2. The cutting portions TS-CP control visibility in thesensing patterns SP1 and SP2. Due to the cutting portions TS-CP definedsporadically, it may be difficult for a user to distinguish between aboundary of each of the sensing patterns SP1 and SP2 and the inside ofeach of the sensing patterns SP1 and SP2. Thus, a problem that thesensing patterns SP1 and SP2 are visible to a user may be preventedimproving the visibility of the electronic device.

FIG. 6A is a plan view illustrating a unit mesh pattern according to anembodiment of the present disclosure. FIG. 6B is a plan viewillustrating some elements of the unit mesh pattern of FIG. 6A.

FIG. 6A illustrates a partial area, corresponding to a unit mesh patternUN-1, of the first and second sensing patterns SP1 and SP2 illustratedin FIG. 2A. Each of the first sensing patterns SP1 and the secondsensing patterns SP2 may have a shape in which the unit mesh patternsUN-1 are continuously arranged.

Referring to FIG. 6A, the unit mesh pattern UN-1 may be defined bytwelve mesh lines intersecting each other. In more detail, the unit meshpattern UN-1 may be defined by first to sixth mesh lines MSL11, MSL12,MSL13, MSL14, MSL15, and MSL16 extending in the fourth direction D4 inparallel to each other and seventh to twelfth mesh lines MSL21, MSL22,MSL23, MSL24, MSL25, and MSL26 extending in the fifth direction D5 inparallel to each other.

The first to sixth mesh lines MSL11, MSL12, MSL13, MSL14, MSL15, andMSL16 may substantially correspond to some of the first mesh lines MSL1illustrated in FIG. 4A, and the seventh to twelfth mesh lines MSL21,MSL22, MSL23, MSL24, MSL25, and MSL26 may substantially correspond tosome of the second mesh lines MSL2 illustrated in FIG. 4A. The unit meshpattern UN-1 may have a diamond shape defined by the fourth direction D4and the fifth direction D5.

The unit mesh pattern UN-1 may include a plurality of openings. Theopenings may include a central opening OP11, a plurality of firstperipheral openings OP21_a, OP21_b, and OP21_c, and a plurality ofsecond peripheral openings OP30_a, OP30_b, and OP30_c.

The central opening OP11 may be disposed at a center of the unit meshpattern UN-1. The third and fourth mesh lines MSL13 and MSL14 among thefirst to sixth mesh lines MSL11 to MSL16 may be relatively close to thecenter of the unit mesh pattern UN-1, and the ninth and tenth mesh linesMSL23 and MSL24 among the seventh to twelfth mesh lines MSL21 to MSL26may be relatively close to the center of the unit mesh pattern UN-1. Thecentral opening OP11 may be defined by the third and fourth mesh linesMSL13 and MSL14 and the ninth and tenth mesh lines MSL23 and MSL24 thatintersect the third and fourth mesh lines MSL13 and MSL14.

Meanwhile, the third, fourth, ninth, and tenth mesh lines MSL13, MSL14,MSL23, and MSL24 defining the central opening OP11 may define apredetermined sub-mesh pattern. The sub-mesh pattern defined by thethird, fourth, ninth, and tenth mesh lines MSL13, MSL14, MSL23, andMSL24 may be substantially the same as the first sub-mesh pattern 10illustrated in FIG. 5B, and thus detailed descriptions thereof areomitted.

The first peripheral openings OP21_a, OP21_b, and OP21_c may be arrangedalong an edge of the central opening OP11. The first peripheral openingsOP21_a, OP21_b, and OP21_c may be defined by the intersection of thesecond to fifth mesh lines MSL12 to MSL15 among the first to sixth meshlines MSL11 to MSL16 and the eighth to eleventh mesh lines MSL22 toMSL25 among the seventh to twelfth mesh lines MSL21 to MSL26.

The first peripheral openings OP21_a, OP21_b, and OP21_c are adjacent tofour sides and four vertexes of the central opening OP11, respectively.In FIG. 6A, three openings OP21_a, OP21_b, and OP21_c among the firstperipheral openings are represented as an example by dotted lines.

Meanwhile, the second to fifth and eighth to eleventh mesh lines MSL12to MSL15 and MSL22 to MSL25 defining the first peripheral openingsOP21_a, OP21_b, and OP21_c may define a predetermined sub-mesh pattern.The sub-mesh pattern defined by the second to fifth and eighth toeleventh mesh lines MSL12 to MSL15 and MSL22 to MSL25 may besubstantially the same as the second sub-mesh pattern 20 illustrated inFIG. 5C, and thus detailed descriptions thereof are omitted.

The second peripheral openings OP30_a, OP30_b, and OP30_c may bearranged along outer edges of the first peripheral openings OP21_a,OP21_b, and OP21_c. In other words, the second peripheral openingsOP30_a, OP30_b, and OP30_c may be arranged along an edge of the sub-meshpattern including the first peripheral openings OP21_a, OP21_b, andOP21_c.

The second peripheral openings OP30_a, OP30_b, and OP30_c may be definedby the intersection of the first to sixth mesh lines MSL11, MSL12,MSL13, MSL14, MSL15, and MSL16 and the seventh to twelfth mesh linesMSL21, MSL22, MSL23, MSL24, MSL25, and MSL26. For the purpose of easeand convenience in description and illumination, FIG. 6B illustrates athird sub-mesh pattern 30 in which the second peripheral openingsOP30_a, OP30_b, and OP30_c are disposed.

As illustrated in FIGS. 6A and 6B, the third sub-mesh pattern 30 may bea pattern in which the second peripheral openings OP30_a, OP30_b, andOP30_c are defined. The third sub-mesh pattern 30 may have aquadrilateral frame shape that surrounds the sub-mesh pattern in whichthe first peripheral openings OP21_a, OP21_b, and OP21_c are defined.

The quadrilateral frame shape corresponding to an outward shape of thethird sub-mesh pattern 30 may be defined by the first, second, fifth,and sixth mesh lines MSL11, MSL12, MSL15, and MSL16, disposed relativelyoutside, among the first to sixth mesh lines MSL11 to MSL16 and theseventh, eighth, eleventh, and twelfth mesh lines MSL21, MSL22, MSL25,and MSL26, disposed relatively outside, among the seventh to twelfthmesh lines MSL21 to MSL26.

In more detail, portions of the second, fifth, eighth, and eleventh meshlines MSL12, MSL15, MSL22, and MSL25 may define inner sides of thequadrilateral frame shape of the third sub-mesh pattern 30, and portionsof the first, sixth, seventh, and twelfth mesh lines MSL11, MSL16,MSL21, and MSL26 may define outer sides of the quadrilateral frame shapeof the third sub-mesh pattern 30. The second, fifth, eighth, andeleventh mesh lines MSL12, MSL15, MSL22, and MSL25 may also define outersides of the sub-mesh pattern in which the first peripheral openingsOP21_a, OP21_b, and OP21_c are defined.

The first to sixth mesh lines MSL11, MSL12, MSL13, MSL14, MSL15, andMSL16 and the seventh to twelfth mesh lines MSL21, MSL22, MSL23, MSL24,MSL25, and MSL26 may intersect the quadrilateral frame shapecorresponding to the outward shape of the third sub-mesh pattern 30,thereby defining the second peripheral openings OP30_a, OP30_b, andOP30_c. The second peripheral openings OP30_a, OP30_b, and OP30_c may bedefined in the third sub-mesh pattern 30.

On the other hand, the third sub-mesh pattern 30 may include a pluralityof cutting lines CT2_a, CT2_b, CT2_c, CT2_d, CT2_e, CT2_f, CT2_g, andCT2_h. Each of the cutting lines CT2_a, CT2_b, CT2_c, CT2_d, CT2_e,CT2_f, CT2_g, and CT2_h may be an imaginary line cutting a portion ofthe mesh line and may have a line shape that links centers of two secondperipheral openings adjacent to each other with a predetermined meshline interposed therebetween.

Each of the cutting lines CT2_a, CT2_b, CT2_c, CT2_d, CT2_e, CT2_f,CT2_g, and CT2_h may cut the mesh line to connect or open the two secondperipheral openings adjacent to each other. Thus, some openings of thesecond peripheral openings OP30_a, OP30_b, and OP30_c may be connectedor opened to each other through the cutting portion TS-CP.

The cutting lines CT2_a, CT2_b, CT2_c, CT2_d, CT2_e, CT2_f, CT2_g, andCT2_h may be arranged along the frame shape. In addition, each of thecutting lines CT2_a, CT2_b, CT2_c, CT2_d, CT2_e, CT2_f, CT2_g, and CT2_hmay extend in parallel to the outer side adjacent thereto in the thirdsub-mesh pattern 30.

Thus, first, fourth, fifth, and eighth cutting lines CT2_a, CT2_d,CT2_e, and CT2_h adjacent to the outer sides defined by the first andsixth mesh lines MSL11 and MSL16 may extend in the fourth direction D4,and second, third, sixth, and seventh cutting lines CT2_b, CT2_c, CT2_f,and CT2_g adjacent to the outer sides defined by the seventh and twelfthmesh lines MSL21 and MSL26 may extend in the fifth direction D5.

The cutting lines CT2_a, CT2_b, CT2_c, CT2_d, CT2_e, CT2_f, CT2_g, andCT2_h may have arrangement that substantially corresponds to thearrangement of the cutting lines in the second sub-mesh pattern 20illustrated in FIG. 5C. Thus, detailed descriptions to the cutting linesCT2_a to CT2_h are omitted.

The unit mesh pattern UN-1 according to an embodiment of the presentdisclosure may include 25 openings. However, the electronic deviceaccording to an embodiment of the present disclosure may include themesh patterns having various numbers may not be limited to the unit meshpattern having a specific number.

In addition, since the electronic device according to an embodiment ofthe present disclosure includes a plurality of the unit mesh patternsUN-1 improving the visibility of the electronic device. This will bedescribed later in more detail.

FIGS. 7A to 7F are plan views related to a unit mesh pattern accordingto an embodiment of the present disclosure. FIGS. 7A and 7B are planviews illustrating a unit mesh pattern UN-2 according to an embodimentof the present disclosure, and FIG. 7C is a plan view illustrating oneof the cutting lines illustrated in FIG. 7B. FIGS. 7D to 7F are planviews illustrating a portion of a sensing pattern in which the unit meshpattern UN-2 of FIGS. 7A and 7B is provided in plurality. Hereinafter,an electronic device according to an embodiment of the presentdisclosure will be described with reference to FIGS. 7A to 7F.

FIG. 7A illustrates a partial area, corresponding to a unit mesh patternUN-2, of the first and second sensing patterns SP1 and SP2 illustratedin FIG. 2A. Each of the first sensing patterns SP1 and the secondsensing patterns SP2 may have a shape in which the unit mesh patternsUN-2 are continuously arranged.

Referring to FIG. 7A, the unit mesh pattern UN-2 is illustrated as aportion cut by a quadrilateral (or square) shape defined by the firstdirection D1 and the second direction D2. As illustrated in FIG. 7A, theunit mesh pattern UN-2 may have a shape different from the diamond shapedefined by the fourth and fifth directions D4 and D5. However,embodiments of the present disclosure are not limited to a particularshape.

The unit mesh pattern UN-2 may be defined by 16 mesh lines intersectingeach other. In more detail, the unit mesh pattern UN-2 may be defined byeight first mesh lines MSL1 extending in the fourth direction D4 inparallel to each other and eight second mesh lines MSL2 extending in thefifth direction D5 to intersect the eight first mesh lines MSL1.

The unit mesh pattern UN-2 may include a plurality of openings. Theopenings may include a central opening OP12 and peripheral openingsdisposed outside the central opening OP12. Adjacent ones of theperipheral openings may be connected or opened to each other. Theperipheral openings may include first peripheral openings arranged alongan edge of the central opening OP12, and second peripheral openingsarranged along an edge of a sub-mesh pattern in which the firstperipheral openings are defined.

The central opening OP12 may be disposed at a center of the unit meshpattern UN-2. The central opening OP12 may substantially correspond tothe central opening OP10 illustrated in FIG. 5B, and the first sub-meshpattern 10 of FIG. 5B may be included in the unit mesh pattern UN-2 eventhough a reference designator for the first sub-mesh pattern 10 is notshown in FIG. 7A.

The first peripheral openings surrounding the central opening OP12 maysubstantially correspond to the peripheral openings OP20_a, OP20_b, andOP20_c illustrated in FIGS. 5A and 5C. Thus, even though referencedesignators for the peripheral openings OP20_a, OP20_b, and OP20_c arenot shown in FIG. 7A, the first peripheral openings and the secondsub-mesh pattern 20 (see FIG. 5B) in which the first peripheral openingsare defined may be included in the unit mesh pattern UN-2.

As described above, the second sub-mesh pattern 20 in which the firstperipheral openings are defined may include a plurality of first cuttinglines CT11_a, CT11_b, CT11_c, and CT11_d. In FIG. 7B, the first cuttinglines CT11_a, CT11_b, CT11_c, and CT11_d are shown as dark lines.Adjacent two of the first peripheral openings may be connected or openedto each other through a cutting portion defined by each of the firstcutting lines CT11_a, CT11_b, CT11_c, and CT11_d.

The first cutting lines CT11_a, CT11_b, CT11_c, and CT11_d havesubstantially the same shapes as the cutting lines CT1_a, CT1_b, CT1_c,and CT1_d illustrated in FIG. 5C. However, it is noted that arrangementpositions of the first cutting lines CT11_a, CT11_b, CT11_c, and CT11_dmay be different from the arrangement positions of the cutting linesCT1_a, CT1_b, CT1_c, and CT1_d illustrated in FIG. 5C.

For example, the arrangement of the first cutting lines CT11_a, CT11_b,CT11_c, and CT11_d may correspond to arrangement in which the cuttinglines CT1_a, CT1_b, CT1_c, and CT1_d of FIG. 5C are shifted with respectto the central opening OP10 (see FIG. 5A) in a counterclockwisedirection by a width of the peripheral opening. Thus, in FIG. 7B, thefirst cutting lines CT11_a, CT11_b, CT11_c, and CT11_d may cut the meshlines corresponding to the mesh lines that are not cut in the firstsub-mesh pattern 20 of FIG. 5C.

However, the arrangement of the first cutting lines CT11_a, CT11_b,CT11_c, and CT11_d illustrated in FIG. 7C is an example. In certainembodiments, the first cutting lines CT11_a, CT11_b, CT11_c, and CT11_dof FIG. 7B may be disposed at the same positions of the cutting linesCT1_a, CT1_b, CT1_c, and CT1_d of FIG. 5C, respectively. However,embodiments of the present disclosure are not limited thereto.

The second peripheral openings may be arranged along an edge of thesecond sub-mesh pattern 20 in which the first peripheral openings aredefined. For the purpose of ease and convenience in description andillumination, first to fifth openings OP31_a, OP31_b, OP31_c, OP31_d,and OP31_e among the second peripheral openings are represented bydotted lines in FIG. 7A. However, these are illustrated as an example.The following descriptions to the first to fifth openings OP31_a,OP31_b, OP31_c, OP31_d, and OP31_e may be applied in common to otherssecond peripheral openings.

The first to fifth openings OP31_a, OP31_b, OP31_c, OP31_d, and OP31_emay be sequentially arranged around the central opening OP12 in acounterclockwise direction. At least one of the first to fifth openingsOP31_a, OP31_b, OP31_c, OP31_d, and OP31_e may be partially illustratedin the unit mesh pattern UN-2.

In the present embodiment, the fourth opening OP31_d may be defined asan opening having an incomplete shape in the unit mesh pattern UN-2. Thefourth opening OP31_d may be surrounded by two intersecting mesh linesMSL1 and MSL2 and a quadrilateral boundary of the unit mesh patternUN-2. Thus, the fourth opening OP31_d may have a triangular shape. Eventhough not shown in FIG. 7A, the fourth opening OP31_d may be connectedto an opening of another unit mesh pattern UN-2 to be defined as aquadrilateral opening.

The second peripheral openings including the first to fifth openingsOP31_a, OP31_b, OP31_c, OP31_d, and OP31_e may define a predeterminedsub-mesh pattern that has a quadrilateral frame shape surrounding theedge of the sub-mesh pattern in which the first peripheral openings aredefined. Hereinafter, the reference designators OP31_a, OP31_b, OP31_c,OP31_d, and OP31_e will be used as both the reference designators of thesecond peripheral openings and the reference designators of the first tofifth openings.

The shape of the sub-mesh pattern in which the second peripheralopenings OP31_a, OP31_b, OP31_c, OP31_d, and OP31_e are defined may besubstantially the same as the shape of the third sub-mesh pattern 30illustrated in FIG. 6B. However, shapes and/or arrangement of cuttinglines and cutting portions in the sub-mesh pattern according to thepresent embodiment may be different from those of the cutting lines andthe cutting portions in the third sub-mesh pattern 30 of FIG. 6B.

In detail, referring to FIGS. 7A and 7B, a plurality of second cuttinglines CT21_a, CT21_b, CT21_c, and CT21_d are defined in the sub-meshpattern having the second peripheral openings OP31_a, OP31_b, OP31_c,OP31_d, and OP31_e. Each of the second cutting lines CT21_a, CT21_b,CT21_c, CT21_d are shown as a combination of dark lines in FIG. 7B.

Shapes of the second cutting lines CT21_a, CT21_b, CT21_c, and CT21_dare different from those of the first cutting lines CT11_a, CT11_b,CT11_c, and CT11_d. Thus, in the unit mesh pattern UN-2, arrangement ofthe cutting portions formed in the sub-mesh pattern having the secondperipheral openings is different from the arrangement of the cuttingportions formed in the sub-mesh pattern having the first peripheralopenings.

FIG. 7C illustrates the second cutting line CT21_a of the second cuttinglines CT21_a, CT21_b, CT21_c, and CT21_d. As illustrated in FIG. 7C, thesecond cutting line CT21_a may include first, second, and third portionsP1, P2, and P3.

Each of the first to third portions P1, P2, and P3 may be a line thatlinks centers of two adjacent openings. Thus, each of the first to thirdportions P1, P2, and P3 may have substantially the same shape as each ofthe first cutting lines CT11_a, CT11_b, CT11_c, and CT11_d. In addition,each of the second cutting line CT21_a may substantially correspond tothree first cutting lines that are connected to each other.

At least two of the first to third portions P1, P2, and P3 may extend indirections different from each other. In the present embodiment, anextending direction of the first portion P1 is different from anextending direction of each of the second and third portions P2 and P3.The second portion P2 is connected between the first portion P1 and thethird portion P3. Thus, the second cutting line CT21_a may have a “¬”shape having a bent portion.

Referring again to FIGS. 7A and 7B, the second cutting lines CT21_a,CT21_b, CT21_c, and CT21_d are arranged around the central opening OP12in a clockwise direction. Adjacent two of the second cutting linesCT21_a, CT21_b, CT21_c, and CT21_d are spaced apart from each other withone mesh line interposed therebetween.

Thus, each of four second peripheral openings overlapping with each ofthe second cutting lines CT21_a to CT21_d can be connected or opened toone(s), adjacent thereto, of the corresponding four second peripheralopenings. In the present embodiment, each of the second cutting linesCT21_a, CT21_b, CT21_c, and CT21_d connects or opens the four secondperipheral openings to each other.

The second to fifth openings OP31_b, OP31_c, OP31_d, and OP31_e amongthe second peripheral openings may be opened and connected to each otherby one second cutting line CT21_c. The first opening OP31_a of the firstto fifth openings OP31_a to OP31_e is opened and connected to anothersecond peripheral opening adjacent thereto by another second cuttingline CT21_d.

Since lengths of the second cutting lines CT21_a to CT21_d are longerthan those of the first cutting lines CT11_a to CT11_d, the secondcutting lines CT21_a to CT21_d may induce continuous arrangement of thecutting portions. Thus, it is possible to increase similarity betweenthe cutting portion and the boundary of a sensor (e.g., the sensingpattern) in which the cutting portions of the mesh lines arecontinuously formed. As a result, it is difficult to distinguish betweenthe boundary of the sensor and the inside of the sensor, therebyimproving the visibility of the electronic device.

On the other hand, the unit mesh pattern UN-2 may further include thirdperipheral openings disposed outside the second peripheral openingsOP31_a, OP31_b, OP31_c, OP31_d, and OP31_e. In the present embodiment,the third peripheral openings may include one diamond-shaped opening andthree triangular openings that are disposed adjacent to each of vertexesof the quadrilateral shape of the unit mesh pattern UN-2. However,embodiments of the present disclosure are not limited thereto. Incertain embodiments, the arrangement and shapes of the third peripheralopenings may be variously modified depending on the size and shape ofthe unit mesh pattern UN-2.

Dummy cutting lines CT_D may be defined in the third peripheralopenings. Each of the dummy cutting lines CT_D may have the same shapeas each of the first cutting lines CT11_a, CT11_b, CT11_c, and CT11_d.In addition, each of the dummy cutting lines CT_D may be parallel to acorresponding one of the first cutting lines CT11_a, CT11_b, CT11_c, andCT11_d. The dummy cutting line CT_D and the first cutting line CT11_a,CT11_b, CT11_c, or CT11_d corresponding to each other may cut the samemesh line.

For example, another portion of the mesh line MSL1 that is cut by one(e.g., CT11_b) of the first cutting lines CT11_a to CT11_d may be cut bythe dummy cutting line CT_D parallel to the first cutting line CT11_b.However, this is illustrated as an example, and embodiments of thepresent disclosure are not limited thereto. In certain embodiments, theshapes and arrangement of the dummy cutting lines included in the unitmesh pattern UN-2 may be variously modified.

Referring to FIGS. 7D to 7F, a sensing pattern including a plurality ofthe unit mesh patterns UN-2 is illustrated. FIG. 7D illustrates a firstunit mesh pattern UN-21 and a second unit mesh pattern UN-22 that areconnected to each other in the first direction D1.

Each of the first and second unit mesh patterns UN-21 and UN-22 may besubstantially the same as the unit mesh pattern UN-2 illustrated inFIGS. 7A and 7B. First cutting lines CT11 illustrated in each of thefirst and second unit mesh patterns UN-21 and UN-22 may correspond tothe first cutting lines CT11_a, CT11_b, CT11_c, and CT11_d illustratedin FIG. 7B, and second cutting lines CT21 illustrated in each of thefirst and second unit mesh patterns UN-21 and UN-22 may correspond tothe second cutting lines CT21_a, CT21_b, CT21_c, and CT21_d illustratedin 7B.

According to one embodiment, the second cutting lines CT21 may be aconnection point of adjacent unit mesh patterns. As illustrated in FIG.7D, the second unit mesh pattern UN-22 is disposed adjacent to a side ofthe first unit mesh pattern UN-21 in the first direction D1, and thus asecond cutting line of the first unit mesh pattern UN-21 that isadjacent to the side in the first direction D1 may be connected toanother second cutting line of the second unit mesh pattern UN-22.

Thus, two second cutting lines CT21 may be connected to each other at aboundary between the first and second unit mesh patterns UN-21 and UN-22to form a new combination cutting line CT-S. The combination cuttingline CT-S may include a first line extending in the fifth direction D5to open three openings, and a second line extending in the fourthdirection D4 to open five openings. The first line intersects the secondline.

FIGS. 7E and 7F illustrate sensing patterns in which two or more meshpatterns UN-2 are arranged to correspond to the arrangement illustratedin FIG. 7D. As illustrated in FIG. 7E, the first cutting lines CT11 maybe arranged to surround each of the central openings.

As described above, each of the second cutting lines CT21 (see FIG. 7D)may function as a connection point at which adjacent unit mesh patternsUN-2 are connected to each other. Thus, the combination cutting linesCT-S are shown in the sensing pattern in which a plurality of unit meshpatterns UN-2 are connected to each other. As a result, the sensingpattern may include a plurality of cutting portions formed by the firstcutting lines CT11 and the combination cutting lines CT-S.

Since the electronic device according to an embodiment of the presentdisclosure includes the unit mesh patterns in which various cuttinglines are defined, the sensing pattern including the cutting portionsthat are arranged in various forms may be provided in the electronicdevice. As a result, it is possible to effectively prevent a problemthat the sensing pattern is visible to a user.

FIGS. 8A to 8C are plan views illustrating a method of manufacturing anelectronic device, according to an embodiment of the present disclosure.FIGS. 8A to 8C illustrate substantially the same area. In FIGS. 8A and8B, cutting lines are represented by dark lines to distinguish thecutting lines from mesh lines. In addition, in FIG. 8C, some of the meshlines are shaded to distinguish the sensing patterns from each other.

Hereinafter, a method of manufacturing an electronic device according toan embodiment of the present disclosure will be described with referenceto FIGS. 8A to 8C. In addition, the same elements as described withreference to FIGS. 1 to 7F will indicated by the same reference numeralsor designators, and the descriptions thereof will be omitted ormentioned briefly for the purpose of ease and convenience in descriptionand illumination.

A partial area of an initial mesh substrate IMS is illustrated in FIGS.8A and 8B. The initial mesh substrate IMS according to an embodiment ofthe present disclosure may include a plurality of mesh linesintersecting each other and a plurality of cutting lines. As describedabove, the cutting lines partially cut the mesh lines. Thus, the meshlines of the initial mesh substrate IMS may be a single conductivepattern and may be electrically connected to each other.

As illustrated in FIG. 8A, the initial mesh substrate IMS is provided.The initial mesh substrate IMS may include a plurality of unit meshpatterns UN10. The unit mesh patterns UN10 may be repeatedly andcontinuously arranged. One of the plurality of unit mesh patterns UN10is represented by the reference designator UN10 in FIG. 8A.

The unit mesh pattern UN10 may include a first sub-mesh pattern 10, asecond sub-mesh pattern 20, and a third sub-mesh pattern 30. The secondsub-mesh pattern 20 may have a quadrilateral frame shape surrounding anedge of the first sub-mesh pattern 10, and the third sub-mesh pattern 30may have a quadrilateral frame shape surrounding an outer edge of thesecond sub-mesh pattern 20.

In the present embodiment, the unit mesh pattern UN10 may besubstantially the same as the unit mesh pattern UN-1 illustrated in FIG.6A. Thus, the first sub-mesh pattern 10 may substantially correspond tothe first sub-mesh pattern 10 illustrated in FIG. 5B, the secondsub-mesh pattern 20 may substantially correspond to the second sub-meshpattern 20 illustrated in FIG. 5C, and the third sub-mesh pattern 30 maysubstantially correspond to the third sub-mesh pattern 30 illustrated inFIG. 6B.

Likewise, the plurality of cutting lines illustrated in FIGS. 8A and 8Bmay substantially the same as the cutting lines CT1_a, CT1_b, CT1_c, andCT1_d illustrated in FIG. 5C and the cutting lines CT2_a, CT2_b, CT2_c,CT2_d, CT2_e, CT2_f, CT2_g, and CT2_h illustrated in FIG. 6B. Thus,detailed descriptions thereof are omitted.

Thereafter, as illustrated in FIG. 8B, a boundary line BL is formed onthe initial mesh substrate IMS. In FIG. 8B, the boundary line BL isshaded to distinguish the boundary line BL from the cutting lines. Someof the cutting lines may be connected to each other to form the boundaryline BL. The boundary line BL formed by connecting some of the cuttinglines of the second sub-mesh patterns 20 of the unit mesh patterns UN10is illustrated as an example in FIG. 8B.

The mesh lines overlapping with the boundary line BL may be additionallycut along the boundary line BL, and thus a plurality of first sensingpatterns SP1-1 and a plurality of second sensing patterns SP2-1 may beformed as illustrated in FIG. 8C. The first sensing patterns SP1-1 andthe second sensing patterns SP2-1 are distinguished from each other bydifferent shades in FIG. 8C. The first sensing patterns SP1-1 and thesecond sensing patterns SP2-1 are spaced apart from each other by theboundary line BL and are electrically insulated from each other.

Since the boundary line BL is defined as a diagonal shape passing thecutting lines of the second sub-mesh pattern 20 in the presentembodiment, the first and second sensing patterns SP1-1 and SP2-1illustrated in FIG. 8C are formed. However, these are illustrated as anexample, and embodiments of the present disclosure are not limitedthereto. In certain embodiments, the shapes of the first and secondsensing patterns SP1-1 and SP2-1 may be variously modified, and theshape of the boundary line BL may also be variously modified. Forexample, the boundary line BL may have a zigzag shape.

A plurality of the cutting portions may be defined in each of the firstand second sensing patterns SP1-1 and SP2-1. The cutting portions mayfunction optical compensation patterns that reduce a difference in lightreflectance between a boundary area between the first and second sensingpatterns SP1-1 and SP2-1 and the inside of each of the first and secondsensing patterns SP1-1 and SP2-1.

Thus, it is difficult for a user to sense a difference between theinside of each of the first and second sensing patterns SP1-1 and SP2-1and the boundary area between the first and second sensing patternsSP1-1 and SP2-1. As a result, a problem that the first and secondsensing patterns SP1-1 and SP2-1 are visible to a user may be solved orimproved.

On the other hand, even though not shown in the drawings, the boundaryline BL may be provided in plurality, and thus dummy patterns may beformed between the first sensing patterns SP1-1 and the second sensingpatterns SP2-1. According to an embodiment of the present disclosure,even though the dummy patterns are formed, the cutting portions formedby the cutting lines may also be formed in the dummy patterns since thedummy patterns are formed through the initial mesh substrate IMS.

As a result, the inside of the dummy pattern, an interval between thedummy and sensing patterns, and the inside of the sensing patterninclude the cutting portions that are formed by the cutting lines havingsubstantially the same regularity, and thus poor visibility of theelectronic device is solved or improved without an additional layer orpattern for optical compensation.

In the method of manufacturing the electronic device according to anembodiment of the present disclosure, the initial mesh substrate IMS onwhich the cutting lines are defined may be provided, and the boundaryline BL may be formed by connecting desired cutting lines among thecutting lines. Various-shaped sensing patterns required by a user may beformed by the combination of the cutting lines that can be variouslyarranged and correspond to extending directions of the mesh lines.

In addition, the cutting lines that are not included in the boundaryline BL in the initial mesh substrate IMS remain in the sensing pattern.The cutting lines remaining in the sensing pattern may control thesensing pattern in such a way that light reflectance in the sensingpattern becomes similar to light reflectance at a boundary of thesensing pattern by optical compensation. Thus, it is difficult todistinguish between the boundary line BL and the inside of the sensingpattern, thereby improving the visibility of the electronic device.

Furthermore, in the method of manufacturing the electronic deviceaccording to an embodiment of the present disclosure, the initial meshsubstrate IMS may be provided to form a sensor including an opticalcompensation pattern by only the process of forming the boundary lineBL. Thus, a process of designing an optical compensation pattern can beomitted to simplify manufacturing processes while reducing a processcost.

FIGS. 9A to 9C are plan views illustrating a method of manufacturing anelectronic device, according to an embodiment of the present disclosure.FIGS. 9A to 9C illustrate substantially the same area. In FIGS. 9A and9B, cutting lines are represented by dark lines to distinguish thecutting lines from mesh lines. In addition, in FIG. 9C, some of the meshlines are shaded to distinguish the sensing patterns from each other.

FIGS. 9A and 9B illustrate a partial area of an initial mesh substrateIMS-1, and FIG. 9C illustrates a partial area of an electronic device.Hereinafter, a method of manufacturing an electronic device according toan embodiment of the present disclosure will be described with referenceto FIGS. 9A to 9C. In addition, the same elements as described withreference to FIGS. 1 to 8C will indicated by the same reference numeralsor designators, and the descriptions thereof will be omitted ormentioned briefly for the purpose of ease and convenience in descriptionand illumination.

As illustrated in FIG. 9A, the initial mesh substrate IMS-1 is provided.The initial mesh substrate IMS-1 may include a plurality of unit meshpatterns UN20. The unit mesh patterns UN20 may be repeatedly andcontinuously arranged. One of the plurality of unit mesh patterns UN20is represented by the reference designator UN20 in FIG. 9A.

The unit mesh pattern UN20 may include a first sub-mesh pattern 10, asecond sub-mesh pattern 20-1, and a third sub-mesh pattern 30-1. In thepresent embodiment, the unit mesh pattern UN20 may partially correspondto the unit mesh pattern UN-2 illustrated in FIG. 7A.

The unit mesh pattern UN20 may correspond to the unit mesh pattern UN-2of FIG. 7A, except for the areas in which the dummy cutting lines CT_Dare defined in FIG. 7A. Thus, first cutting lines CT11 defined in thesecond sub-mesh pattern 20-1 of the unit mesh pattern UN20 maysubstantially correspond to the first cutting lines CT11_a, CT11_b,CT11_c, and CT11_d illustrated in FIG. 7B, and second cutting lines CT21defined in the third sub-mesh pattern 30-1 may substantially correspondto the second cutting lines CT21_a, CT21_b, CT21_c, and CT21_dillustrated in 7B.

In the present embodiment, the unit mesh patterns UN20 may be arrangedusing the mesh lines, defining a boundary of each unit mesh patternUN20, as boundary lines. Thus, even though the unit mesh pattern UN20includes the first to third sub-mesh patterns 10, 20-1, and 30-1 thatare the same as those of the unit mesh pattern UN-2 illustrated in FIG.7A, the sensing pattern different from the sensing pattern of FIG. 7Dmay be formed on the initial mesh substrate IMS-1. The shapes of themesh patterns of the electronic device according to an embodiment of thepresent disclosure may be variously modified depending on the shapesand/or arrangement of the cutting lines and the arrangement of the unitmesh patterns, and thus embodiments of the present disclosure are notlimited to a specific one of the various shapes of the mesh patterns.

Thereafter, as illustrated in FIGS. 9B and 9C, a boundary line BL-1 maybe formed on the initial mesh substrate IMS-1 to form a plurality offirst sensing patterns SP1-2 and a plurality of second sensing patternsSP2-2. As described above, the boundary line BL-1 may be formed byconnecting some of the cutting lines CT11 and CT21. In the presentembodiment, the boundary line BL-1 may have a diagonal shape thatextends along at least portions of some of the second cutting lines CT21defined in the third sub-mesh patterns 30-1.

However, embodiments of the present disclosure are not limited thereto.In certain embodiments, the boundary line BL-1 may be formed along atleast portions of some of the first cutting lines CT11 or may be formedto have a line shape that connects portions of the first cutting linesCT11 and portions of the second cutting lines CT21. In addition, theboundary line BL-1 having the diagonal shape is illustrated in thepresent embodiment for the purpose of ease and convenience indescription and illumination. However, embodiments of the presentdisclosure are not limited thereto. In certain embodiments, the boundaryline BL-1 may have another shape such as a zigzag shape.

A plurality of cutting portions formed by remaining cutting lines may bedefined in the first and second sensing patterns SP1-2 and SP2-2. Thus,the electronic device with improved visibility may be manufactured.

FIGS. 10A to 10C are plan views illustrating a method of manufacturingan electronic device, according to an embodiment of the presentdisclosure. FIGS. 10A to 10C illustrate substantially the same area. InFIGS. 10A and 10B, cutting lines are represented by dark lines todistinguish the cutting lines from mesh lines. In addition, in FIG. 10C,some of the mesh lines are shaded to distinguish the sensing patternsfrom each other.

FIGS. 10A and 10B illustrate a partial area of an initial mesh substrateIMS-2, and FIG. 10C illustrates a partial area of an electronic device.Hereinafter, a method of manufacturing an electronic device according toan embodiment of the present disclosure will be described with referenceto FIGS. 10A to 10C. In addition, the same elements as described withreference to FIGS. 1 to 9C will indicated by the same reference numeralsor designators, and the descriptions thereof will be omitted ormentioned briefly for the purpose of ease and convenience in descriptionand illumination.

As illustrated in FIG. 10A, the initial mesh substrate IMS-2 isprovided. The initial mesh substrate IMS-2 may include a plurality ofunit mesh patterns repeatedly and continuously arranged. Each of theunit mesh patterns may include a first sub-mesh pattern 10, a pluralityof fourth sub-mesh patterns 40_a, 40_b, 40_c, and 40_d, and a pluralityof fifth sub-mesh patterns 50_a, 50_b, 50_c, and 50_d. The firstsub-mesh pattern 10 may be substantially the same as the first sub-meshpattern 10 illustrated in FIG. 5B, and thus the descriptions thereof areomitted.

The fourth sub-mesh patterns 40_a, 40_b, 40_c, and 40_d and the fifthsub-mesh patterns 50_a, 50_b, 50_c, and 50_d may be arranged to surroundthe edge of the first sub-mesh pattern 10. The fourth sub-mesh patterns40_a, 40_b, 40_c, and 40_d are disposed adjacent to four sides of thefirst sub-mesh pattern 10 extending from the first-sub-mesh pattern 10outwardly, respectively.

Each of the fourth sub-mesh patterns 40_a, 40_b, 40_c, and 40_d mayinclude three peripheral openings. A fourth cutting line CT4 is definedin each of the fourth sub-mesh patterns 40_a, 40_b, 40_c, and 40_d.

The fourth cutting line CT4 may be a straight line that links centers ofthe three peripheral openings. The fourth cutting line CT4 opens thethree peripheral openings. The fourth cutting line CT4 may extend in adirection perpendicular to one, adjacent thereto, of the fourth sides ofthe first sub-mesh pattern 10.

The fifth sub-mesh patterns 50_a, 50_b, 50_c, and 50_d are disposedadjacent to four vertexes of the first sub-mesh pattern 10 having adiamond shape, respectively. Each of the fifth sub-mesh patterns 50_a,50_b, 50_c, and 50_d may have a diamond shape, and one vertex of each ofthe fifth sub-mesh patterns 50_a, 50_b, 50_c, and 50_d may be connectedto each of the vertexes of the first sub-mesh pattern 10. Thus, thefourth sub-mesh patterns 40_a, 40_b, 40_c, and 40_d and the fifthsub-mesh patterns 50_a, 50_b, 50_c, and 50_d may be alternately arrangedaround the first sub-mesh pattern 10.

The number of peripheral openings included in each of the fifth sub-meshpatterns 50_a, 50_b, 50_c, and 50_d may be changed depending on thenumber of the peripheral openings included in each of the fourthsub-mesh patterns 40_a, 40_b, 40_c, and 40_d. When each of the fourthsub-mesh patterns 40_a, 40_b, 40_c, and 40_d includes N peripheralopenings (where ‘N’ is a natural number), each of the fifth sub-meshpatterns 50_a, 50_b, 50_c, and 50_d may include N×N peripheral openingsthat are arranged in an N×N matrix form.

In the present embodiment, each of the fifth sub-mesh patterns 50_a,50_b, 50_c, and 50_d may include nine peripheral openings arranged in a3×3 matrix form. A fifth cutting line CT5 is defined in each of thefifth sub-mesh patterns 50_a, 50_b, 50_c, and 50_d.

The fifth cutting line CT5 may have a closed-loop shape that linkscenters of the peripheral openings. In the present embodiment, the fifthcutting line CT5 opens four peripheral openings. Each of the peripheralopenings overlapping with the fifth cutting line CT5 may be opened totwo peripheral openings adjacent thereto.

The fifth cutting line CT5 may be disposed at one of various positionsin each of the fifth sub-mesh patterns 50_a, 50_b, 50_c, and 50_d. Inthe present embodiment, the fifth cutting line CT5 may be disposedadjacent to the first sub-mesh pattern 10. Alternatively, the fifthcutting line CT5 may be disposed away from the first sub-mesh pattern10. However, embodiments of the present disclosure are not limited to aspecific example.

Thereafter, as illustrated in FIGS. 10B and 10C, a boundary line BL-2may be formed on the initial mesh substrate IMS-2 to form a plurality offirst sensing patterns SP1-3 and a plurality of second sensing patternsSP2-3. As described above, the boundary line BL-2 may be formed byconnecting some of the cutting lines CT4 and CT5. In the presentembodiment, the boundary line BL-2 may have a diagonal shape thatextends along some of the fourth cutting lines CT4.

However, embodiments of the present disclosure are not limited thereto.In certain embodiments, the boundary line BL-2 may be formed alongportions of the fifth cutting lines CT5 or may be formed to have a lineshape that connects portions of the fourth cutting lines CT4 andportions of the fifth cutting lines CT5. In addition, the boundary lineBL-2 having the diagonal shape is illustrated in the present embodimentfor the purpose of ease and convenience in description and illumination.However, embodiments of the present disclosure are not limited thereto.In certain embodiments, the boundary line BL-2 may have another shapesuch as a zigzag shape.

A plurality of cutting portions formed by remaining cutting lines may bedefined in the first and second sensing patterns SP1-3 and SP2-3. Thus,the electronic device with improved visibility may be manufactured.

FIGS. 11A to 11C are plan views illustrating a method of manufacturingan electronic device, according to an embodiment of the presentdisclosure. FIGS. 11A to 11C illustrate substantially the same area. InFIGS. 11A and 11B, cutting lines are represented by dark lines todistinguish the cutting lines from mesh lines. In addition, in FIG. 11C,some of the mesh lines are shaded to distinguish the sensing patternsfrom each other.

FIGS. 11A and 11B illustrate a partial area of an initial mesh substrateIMS-3, and FIG. 11C illustrates a partial area of an electronic device.Hereinafter, a method of manufacturing an electronic device according toan embodiment of the present disclosure will be described with referenceto FIGS. 11A to 11C. In addition, the same elements as described withreference to FIGS. 1 to 10C will indicated by the same referencenumerals or designators, and the descriptions thereof will be omitted ormentioned briefly for the purpose of ease and convenience in descriptionand illumination.

As illustrated in FIG. 11A, the initial mesh substrate IMS-3 isprovided. The initial mesh substrate IMS-3 may include a plurality ofunit mesh patterns repeatedly and continuously arranged. Each of theunit mesh patterns may include a first sub-mesh pattern 10, a pluralityof fourth sub-mesh patterns 41_a, 41_b, 41_c, and 41_d, and a pluralityof fifth sub-mesh patterns 51_a, 51_b, 51_c, and 51_d. The firstsub-mesh pattern 10 may be substantially the same as the first sub-meshpattern 10 illustrated in FIG. 5B, and thus the descriptions thereof areomitted.

The fourth sub-mesh patterns 41_a, 41_b, 41_c, and 41_d and the fifthsub-mesh patterns 51_a, 51_b, 51_c, and 51_d may be arranged to surroundthe edge of the first sub-mesh pattern 10. The fourth sub-mesh patterns41_a, 41_b, 41_c, and 41_d are disposed adjacent to four sides of thefirst sub-mesh pattern 10 extending from the first sub-mesh pattern 10outwardly, respectively.

The fourth sub-mesh patterns 41_a, 41_b, 41_c, and 41_d maysubstantially correspond to or may be the same as the fourth sub-meshpatterns 40_a, 40_b, 40_c, and 40_d illustrated in FIG. 10A,respectively. Fourth cutting lines CT41 defined in the fourth sub-meshpatterns 41_a, 41_b, 41_c, and 41_d may substantially correspond to ormay be the same as the fourth cutting lines CT4 illustrated in FIG. 10A.Thus, detailed descriptions thereof are omitted.

The fifth sub-mesh patterns 51_a, 51_b, 51_c, and 51_d are disposedadjacent to four vertexes of the first sub-mesh pattern 10 having adiamond shape, respectively. Shapes and arrangement of the fifthsub-mesh patterns 51_a, 51_b, 51_c, and 51_d may substantiallycorrespond to or may be the same as those of the fifth sub-mesh patterns50_a, 50_b, 50_c, and 50_d illustrated in FIG. 10A. Thus, detaileddescriptions thereof are omitted.

A sixth cutting line CT51A and a seventh cutting line CT51B may bedisposed in each of the fifth sub-mesh patterns 51_a, 51_b, 51_c, and51_d. The sixth cutting line CT51A and the seventh cutting line CT51Bmay have straight line shapes having an equal length and may intersecteach other. Thus, the sixth cutting line CT51A and the seventh cuttingline CT51B may constitute an X-shaped pattern.

Each of the sixth and seventh cutting lines CT51A and CT51B has the samelength and shape as the fourth cutting line CT41. Thus, each of thesixth and seventh cutting lines CT51A and CT51B opens three peripheralopenings. In the present embodiment, the sixth and seventh cutting linesCT51A and CT51B are disposed to open five peripheral openings in each ofthe fifth sub-mesh patterns 51_a to 51_d, and one of the five peripheralopenings may be connected or opened to four peripheral openings adjacentthereto.

However, these are illustrated as an example, and embodiments of thepresent disclosure are not limited thereto. In certain embodiments, theshapes and arrangement of the sixth and seventh cutting lines CT51A andCT51B may be variously modified, and thus the peripheral openings ofeach of the fifth sub-mesh patterns 51_a to 51_d may be connected oropened to adjacent peripheral openings in various forms.

Thereafter, as illustrated in FIGS. 11B and 11C, a boundary line BL-3may be formed on the initial mesh substrate IMS-3 to form a plurality offirst sensing patterns SP1-4 and a plurality of second sensing patternsSP2-4. As described above, the boundary line BL-3 may be formed byconnecting some of the cutting lines CT41, CT51A, and CT51B. In thepresent embodiment, the boundary line BL-3 may have a diagonal shapethat extends along some of the fourth cutting lines CT41.

However, embodiments of the present disclosure are not limited thereto.In certain embodiments, the boundary line BL-3 may be formed alongportions of the sixth cutting lines CT51A or the seventh cutting linesCT51B or may be formed to have a line shape that connects portions ofthe fourth cutting lines CT41 and portions of the sixth cutting linesCT51A or the seventh cutting lines CT51B. In addition, the boundary lineBL-3 having the diagonal shape is illustrated in the present embodimentfor the purpose of ease and convenience in description and illumination.However, embodiments of the present disclosure are not limited thereto.In certain embodiments, the boundary line BL-3 may have another shapesuch as a zigzag shape.

A plurality of cutting portions formed by remaining cutting lines may bedefined in the first and second sensing patterns SP1-4 and SP2-4. Thus,the electronic device with improved visibility may be manufactured.

According to embodiments of the present disclosure, various-shapedsensing patterns may be formed through an initial mesh substrate inwhich the cutting lines variously arranged and corresponding toextending directions of the mesh lines are defined.

In addition, since the optical compensation patterns are formed, it isdifficult to distinguish sensors from each other. Thus, the visibilityof the electronic device may be improved.

Furthermore, according to the manufacturing method according to thepresent disclosure, the sensor having the optical compensation patternmay be formed by only the process of forming the boundary line, and thusmanufacturing processes may be simplified, and a process cost may bereduced.

While the present disclosure has been described with reference toexample embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirits and scopes of the present disclosure. Therefore, itshould be understood that the above embodiments are not limiting, butillustrative. Thus, the scopes of the present disclosure are to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing description.

What is claimed is:
 1. A method of manufacturing an electronic device,the method comprising: providing an initial mesh substrate comprisingfirst mesh lines extending in a first direction and parallel to eachother in a second direction that intersects the first direction, andsecond mesh lines extending in the second direction and parallel to eachother in the first direction, wherein the initial mesh substratecomprises a plurality of unit mesh patterns, and a plurality of cuttinglines that cuts portions of the first and second mesh lines are definedin each of the unit mesh patterns; cutting the first and second meshlines along a boundary line connecting at least some of the cuttinglines to form a plurality of sensing patterns; and forming an insulatinglayer on the plurality of sensing patterns, wherein the cutting linesare imaginary lines corresponding to cut portions of the first andsecond mesh lines, and each of the imaginary lines extends in the firstdirection or the second direction and connects centers of two openingsadjacent to each other.
 2. The method of claim 1, wherein the unit meshpattern comprises: a central mesh pattern in which a central opening isdefined; and a sub-mesh pattern in which peripheral openings thatsurround the central opening are defined, wherein the cutting lines aredefined in the sub-mesh pattern to open at least two of the peripheralopenings to each other.
 3. The method of claim 2, wherein the cuttinglines are spaced apart from each other and are arranged in a clockwisedirection or counterclockwise direction around the central mesh pattern.4. The method of claim 3, wherein at least one of the cutting lines hasa cross shape that comprises: a first pattern extending in the firstdirection; and a second pattern extending in the second direction andcrossing over the first pattern, and wherein a crossing point of thefirst and second patterns is a center of one of the peripheral openings.5. The method of claim 3, wherein at least one of the cutting lines hasa closed-loop shape.
 6. The method of claim 1, wherein the cutting ofthe first and second mesh lines along the boundary line comprisescutting the mesh lines disposed between the at least some of the cuttinglines, and wherein each of the at least some of the cutting linesentirely overlaps with the boundary line.
 7. The method of claim 1,further comprising: forming a bridge pattern connecting some of theplurality of sensing patterns on the insulating layer, wherein theforming of the insulating layer comprises: forming an insulating layercovering the plurality of sensing patterns; and forming a contact holein the insulating layer.